Download e-book for kindle: Adhesives Technology for Electronic Applications. Materials, by James J. Licari

By James J. Licari

ISBN-10: 0815515138

ISBN-13: 9780815515135

  • "I suggest this booklet with no reservation to all people in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley

Content:
Preface

, Pages vii-viii
Acknowledgements

, Pages ix-x
1 - Introduction

, Pages 1-37
2 - features and thought of Adhesives

, Pages 39-94
3 - Chemistry, formula, and homes of Adhesives

, Pages 95-168
4 - Adhesive Bonding Processes

, Pages 169-260
5 - Applications

, Pages 261-346
6 - Reliability

, Pages 347-391
7 - attempt and Inspection Methods

, Pages 393-430
Appendix

, Pages 431-439
Index

, Pages 441-457

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Additional info for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability

Sample text

10. 1% to 1% by weight of the organosilane in a mixture of 95% methanol and 5% water. [40] Organosilanes are also used to coat filler particles to enhance their adhesion to the resin matrix in formulating metal-filled epoxy or polyimide adhesives. Hydrogen bonding. One mechanism for bonding highly polar polymers to equally polar sites on substrate surfaces involves hydrogen bonding (Hbonding). [41] H-bonding is the attractive force between atoms or groups of opposite polarities without actually forming a chemical bond.

3 � HISTORY OF ADHESIVES IN ELECTRONIC APPLICATIONS The basic polymer resins used in adhesives formulations are not new. , and Monsanto. [34] The assembly of devices and components started shortly after the invention of the transistor by using solder (primarily tin-lead), eutectic alloys (gold-silicon, gold-tin), and wire (copper, aluminum, or gold). In the early 1960s, polymeric adhesives and, in fact, any organic materials in hermetically sealed electronic packages, were not allowed in military programs, and rightfully so, since adhesives first used were off-the-shelf commercial products not intended to meet the reliability standards of aerospace programs.

Cohesive and adhesive strengths of adhesives develop during the curing or polymerization process and reach maximum values at some optimum time and temperature conditions, usually determined empirically by measuring shear strength or another desired property as a function of increasing cure schedules. [1] The degree of polymerization or completeness of cure may also be measured by infrared spectroscopy by the amount of reduction of absorption of specific groups as they are converted by crosslinking through addition or condensation polymerization.

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Adhesives Technology for Electronic Applications. Materials, Processes, Reliability by James J. Licari


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